Bemis Company to Present at Wachovia 2nd Annual Transportation and Packaging Conference

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Source: Melanie E. R. Miller: Vice President, Investor Relations and Treasurer
Date: 9/4/2008

Neenah, WI — September 4, 2008 — Bemis Company (NYSE:BMS) President and Chief Executive Officer, Henry Theisen will present at the Wachovia 2nd Annual Transportation and Packaging Conference in New York City on Tuesday, September 9, 2008 at 11:05 a.m. Eastern time.

A live webcast of Theisen's presentation will be available through the Bemis Company website at www.bemis.com. Interested parties can find the presentation in the Investor Relations section of the Bemis website. Listeners should go to the website prior to the presentation to download any necessary audio software. 

About Bemis Company, Inc.

Bemis Company is a major supplier of flexible packaging and pressure sensitive materials used by leading food, consumer products, manufacturing, and other companies worldwide. Founded in 1858, the Company reported 2007 net sales of $3.6 billion. The Company's flexible packaging business has a strong technical base in polymer chemistry, film extrusion, coating and laminating, printing, and converting. The Company's pressure sensitive materials business specializes in adhesive technologies. Headquartered in Neenah, Wisconsin, Bemis employs about 15,700 individuals in 56 manufacturing facilities in 10 countries around the world. More information about the Company is available at our website, www.bemis.com.

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